GlobalFoundries Breaks Ground on First New Fab in Historic U.S.-Japan Chip Partnership
Original headline: (PR) GlobalFoundries Breaks Ground on First New Semiconductor Fab Under Landmark U.S.-Japan Initiative — techpowerup.com
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GlobalFoundries has officially broken ground on the first new semiconductor manufacturing facility at its Malta, New York site. This event marks the start of construction for a 300mm wafer fabrication plant, backed by a unique U.S.-Japan initiative that brings together Japanese investment with GF's technology and manufacturing expertise. The project is the first of two planned fabs under this landmark partnership.
This development represents a significant expansion of trusted U.S. semiconductor manufacturing capacity, specifically targeting growing demand in automotive, industrial, and connected infrastructure markets. With an initial investment of approximately $10 billion supported by New York State incentives, the first fab is expected to begin operations in 2029, followed by a second fab with additional $10 billion investment. This partnership showcases how international cooperation is accelerating domestic chip production to meet critical industry needs.
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